ExOptronics provides full 2-4 inch size wafer process service, from:
- Photo mask CAD
- lithography (align and realignment)
- PECVD of SiO2 and SiNx
- RIE of SiO2 and SiNx
- Metalization with/without step coverage
- Substrate thinning & lapping
- Wafer cleaving and break (>200μm cavity length)
- Bar loading into coating jig (>200μm cavity length)
- HR/AR coating
Please contact sales01@Exoptronics.com for the quotes & specifications:
- 1310/1550/1490nm 2.5Gbit/s uncooled InGaAsP MQW Buriedheterostructure(BH) or Ridgewaveguide DFB laser wafer
- 1310 uncooled 10 Gbit/s uncooled InGaAsP or InGaAlAs BH or RW DFB laser wafer
- Research and Development, as well as custom development of special laser device, such as EML, MZ, PIC, DWDM.
